WALTER OFER ABRAMSOHN is an experienced hardware designer with over 20 years of experience planning and building boards. He managed PCB design for NetApp, Drobo and Infineon, among others, and has designed boards for the enterprise, consumer and IC design markets.
EDWARD ACHESON is a principal product engineer for Allegro PCB products at Cadence Design Systems, focusing on DfM, ECAD-MCAD (EDMD Schema), as well as the IPC-2581 Consortium. Acheson joined Cadence in 1990 and has played several roles, including software developer, consulting and process services engineer. In addition to his product engineer duties, he leads the technical working group in the IPC-2581 Consortium. Prior to Cadence, Acheson was one of the first ECAD users at Wang Labs.
CRAIG ARMENTI is a PCB marketing engineer for Mentor Graphics with a focus on the Xpedition tool suite. Over the past 25 years he has held marketing and application engineering positions with several major telecommunication and software companies. He holds a bachelor’s in electrical engineering technology and an MBA in management.
DANIEL BEEKER is senior member of the technical staff at NXP Semiconductor. With 40 years’ experience in electronic system design and EMC, he provides applications support for NXP Automotive customers worldwide. He also supports NXP customers globally with special function development tools and instrumentation (almost all of the "LFxxx" tools on the NXP website). Beeker specializes in EMC and signal integrity design techniques for systems and PCBs, especially in low layer count designs, and is involved with IC package design and IC development tool teams to support improved EMC performance. He teaches field-based design techniques at NXP and industry conferences worldwide. He is also involved with NXP IC package design and IC development tool teams to support improved EMC performance.
NITIN BHAGWATH is an electrical engineer with more than 15 years’ experience in high-speed board design experience at Hewlett Packard and Cisco. He has been with Mentor Graphics for a year and supports the DDR Wizard in HyperLynx. He has a bachelor’s from Bangalore University, a master’s in electrical engineering from Purdue and also an MBA from the Indian Institute of Management at Bangalore.
ROBERT BOGUSKI is a 1981 graduate of the University of San Francisco, with a BA in economics. He has worked in the electronics packaging and interconnect manufacturing business, primarily in management positions, since 1975. He has 22 years in the bare board business, 12 years in the EMS business, and 12 years in the testing and test engineering business. Boguski is the owner and president of Datest, a test engineering and failure analysis company in Fremont, California. He and Datest are members of EIPC, SMTA, IPC, and IEEE. Since 2013 Boguski has coauthored the Test and Measurement column for Circuits Assembly magazine. He is currently the president of the SMTA Silicon Valley Chapter.
DOUGLAS BROOKS has bachelor’s and master’s degrees in electrical engineering from Stanford University and a Ph.D. from the University of Washington. He has held positions in engineering, marketing, and general management with Hughes Aircraft, Texas Instruments and ELDEC. Brooks owned his own manufacturing company, and in 1992 formed UltraCAD Design Inc.
RALF BRÜNING is product manager and senior consultant at the Zuken EMC Technology Centre in Paderborn, Germany. He has more than 25 years’ experience in electronics and EDA. He has technical co-responsibility for the architecture of Zuken's high-speed design, signal integrity, power integrity and EMI solutions. He is an active member of the IBIS Open Forum. He represented Zuken as well as Work-Package Leader for eMobility Electronic Design & Simulation issues in the European Union funded multinational/Pan-European research project EM4EM, which was awarded in 2015 with the CATRENE innovation award of the European Union. Part of his responsibility is to help customers in implementing signal- and power-integrity analysis in their PCB design flows and project consulting. He holds a degree in computer science, electrical engineering and economics from the University of Paderborn.
JOHN CARNEY has been an application engineer with Cadence for 18 years supporting the Allegro and Sigrity product line. He has a bachelor’s in electrical engineering from Southern Illinois University.
MICHAEL CATRAMBONE is principal product engineer at Cadence Design Systems, where he has worked for nearly four years. Prior to that, he held senior PCB designer positions at Plexus, Northrop Grumman, US Robotics and ASI, and for nearly 13 years was distinguished engineer, PCB/mechanical at UTStarcom.
KEVEN COATES has been a development engineer at Geospace Technologies for four years, where he works designing wireless seismic recording devices, battery testers/chargers, and battery protection circuits. His work concentrates on embedded processors, low noise circuits, high power circuits, battery safety, and battery management. He spent the previous 20 years working for Texas Instruments specializing in high-speed PCB layout/signal integrity, BGA layout, thermal issues, and PCB-friendly BGA packaging for consumer and automotive applications. He holds a bachelor’s degree from Texas A&M University.
PAUL COOKE is director of technical sales at FTG Circuits (Firan Technology Group). He has more than 30 years’ experience in PWB design and manufacturing. He has held senior positions in operations, quality, process engineering and field application engineering at some of the top North American PCB manufacturers. He has served on a number of IPC technical committees, including IPC-9121 and IPC-9151. He has coauthored numerous technical papers, working with Tier 1 companies, focusing on PCB design and reliability. He has provided DfM consulting services to the industry, along with extensive training/educational presentations from PCB 101 through enhanced reliability. Cooke’s current position is focused on working with designers in the avionics and space industry to design and develop products that need to have extended life and long-term reliability in harsh environments.
JOHN COONROD is technical marketing manager for Rogers Corp., Advanced Circuit Materials Connectivity Solutions Division. He has 30 years’ experience in the PCB industry, about half in flexible circuits in circuit design, applications, processing and materials engineering. The past 15 years have been spent supporting high-frequency circuit materials involving circuit fabrication, providing application support and conducting electrical characterization studies. He is vice chair of the IPC High Frequency Test Methods Task Group and holds a bachelor’s in electrical engineering from Arizona State University.
MICHAEL CREEDEN has over 40 years of industry experience as a PCB designer, applications engineer and business owner. He is an IPC Designer Certification Master Instructor CID+, and was a primary contributor for the CID+ (IPC-CID+ Advanced Certified Interconnect Designer) curriculum. He teaches IPC-CID/CID+ curriculum through EPTAC, and is a community college instructor. He owns San Diego PCB, which employs 20 designers, utilizing most of the major CAD tools.
ERIC DELOS ANGELES CUATON is a PCB design engineer at Analog Devices, where he has spent the past seven years, having joined the company as a PCB debug engineer. He is IPC CID designer, and holds a bachelor’s in electronic and communications engineering from the Technological University of the Philippines - Manila.
VINCENT DI LELLO, CID+, has designed PCBs ranging from the Pebble Watch to boards that have gone onto space and inside Las Vegas machines. A product engineer, he makes designers’ lives easier by influencing Cadence software development.
ERICSON MONTILLANO ESCALANTE has been with Analog Devices Philippines since 1997, beginning as an OJT for test equipment engineering. In 2001, he became a supervisor tasked to maintain different ATE machines. In 2006 he transferred to the board repair group of ADI's own ATE. Since 2010 he has been in PCB development. He is an alumnus of the Technological University of the Philippines-Taguig in electronics technology.
MATTHEW FIELDER earned his bachelor’s and master’s degrees from the University of Nebraska in manufacturing engineering and biomechanics before joining the Neuroscience Laboratory at the NASA Johnson Space Center in Houston, TX. His dedicated interest in research and development with 3D printing is breaking new ground by assisting companies and institutions to adapt advanced manufacturing practices. re:3D is a Texas-based additive manufacturing technology company tackling industrial 3D printing. re:3D’s flagship product, Gigabot, is the world’s largest industrial 3D printer under $9K.
MARK FINSTAD has more than 30 years’ experience building and designing flex circuits. He coauthors the "Ask the Flexperts" column in PRINTED CIRCUIT DESIGN & FAB magazine, and is currently a senior application engineer with Flexible Circuit Technologies.
SIMON FRIED is chief business officer and cofounder of Nano Dimension, a leading 3D printed electronics company developing technologies that enable new ways of making electronics. Previously he had 15 years’ experience as a strategy consultant and marketing advisor to multinationals and startups, spanning a range of industries, including financial services, fast-moving consumer goods (FMCG), automotive, retail, medical devices and software. Past positions include roles with Michael Porter's Monitor Co., the UK Financial Services Authority, Oxford Risk Consultancy, Mountainview, Oxford University, Eternegy and as cofounder of the Milk & Honey whisky distillery. Fried received an MBA from SDA Bocconi, a master’s in behavioral economics from Oxford University and a bachelor’s in the psychology of risk and choice from University College London.
RAY FUGITT has nearly 30 years’ experience in EDA, 15 in PCB manufacturing (HAL, dry film, AOI, and electrical test). He was a CAM supervisor at Hadco Tech Center 2. Fugitt joined ACT in 2000 to support the CAM350 product line. He now supports CAM350 and BluePrint products in a technical sales role with DownStream Technologies.
JAY GORAJIA is director of consulting, PCB design and manufacturing services, for the Consulting division at Mentor. He works with contract manufacturers and OEMs to improve efficiency and define cost, quality and productivity improvement solutions in design quality, design to manufacturing, manufacturing engineering and production manufacturing using a systematic, metrics-based methodology. Gorajia has a bachelor’s in electronic engineering and a MBA in technology management. He has published a number of articles and white papers in technical magazines and industry conferences on topics ranging from dynamic production planning to optimizing process performance to factory, among others. He is a regular speaker at SMTA regional conferences and IPC chapter workshops and meetings, and on IPC committees.
JIM HALL is principal consultant and resident Lean Six Sigma Master Black Belt with ITM Consulting. His area of responsibility includes working with OEMs, contract assemblers, and equipment manufacturers to solve design and assembly problems, optimize facility operations, as well as teach basic and new technologies in private and public forums throughout the worldwide industry. Since joining ITM in 2000, he has helped clients in such areas as SMT implementation and assembly facility setup, manufacturing yield improvement, and process audits and improvement. He is coauthor of the SMTA Process Certification Course.
MILAN HAMMER is an experienced electronics hardware engineer with 20 years’ experience in RF and microwave design. His company, Mil1 Ltd., provides services related to design of electronic devices on the IC and/or application level. He is mostly focused on RF/microwave design and electromagnetic compatibility. He has cooperated with several well-known companies such as Sony, Kathrein, ON Semiconductor and NXP Semiconductor.
ROBERT HANSON has more than 40 years’ experience in design, manufacturing, and testing. He has bachelor’s degrees in industrial engineering, business administration, and both a bachelor's and master's degree in electrical engineering. Hanson’s experience includes as a digital design engineer at Boeing, Rockwell, Honeywell, and Loral. He teaches and consults internationally to corporations, conventions, universities, and other entities.
BILL HARGIN is director of North American marketing for Nan Ya Plastic’s PCB laminate division in Taiwan. He has 15 years’ experience in PCB signal integrity, previously serving as product manager for Mentor Graphics’ HyperLynx SI software. Hargin has spent much of the last three years focused on stackup, PDN design and PCB materials selection.
RICK HARTLEY is principal of RHartley Enterprises, resolving noise, signal integrity and EMI problems. Hartley has a degree in engineering from Ohio Technical Institute and 49 years of experience with companies such as L3 Avionics and BF Goodrich. He is a past member of the Editorial Review Board of Printed Circuit Design magazine and has written numerous technical papers and articles on methods to control noise, EMI and signal integrity.
DAVE HOOVER is field application engineer at TTM Technologies, where he has worked since 2011. He has 25 years’ experience in printed circuit board fabrication and development of HDI, microvias and other leading technologies at such companies as Hadco, Sanmina, Data Circuit, Multek and Cisco.
NEIL HUBBLE is director of engineering at Akrometrix, having shifted to this role after almost 10 years of experience as an application engineer. His primary expertise is in temperature warpage measurement techniques. His primary responsibility is leading product development for Akrometrix equipment and software solutions, along with leading technical studies. He has a degree in mechanical engineering from the Georgia Institute of Technology.
EDWARD HUGHES has over the past 20 years built, turned around and sold technology and consumer product companies. Prior to Aculon, he founded PowerMetal Technologies, a supplier of nanotech-enabled components for the golf and sporting goods market. Before that, he was senior VP and GM for TaylorMade-adidas Golf, heading up the North American business division and global marketing. He also helped turn Maxfli as VP/GM. Prior roles include director of strategy and group marketing manager at Pillsbury. He has a master's from the University of Cambridge in England and an MBA from Harvard Business School, where he graduated with High Distinction and was a George F. Baker Scholar.
RON HUNT is a structural analysis and dynamics engineer supporting the NASA Marshall Space Flight Center. His background is in the dynamic analysis and testing of aircraft, satellites, and launch vehicles. He has a master’s in MSME from University of California, Davis.
COSMIN IORGA, PH.D., has accumulated over 20 years of experience in high-speed analog and mixed-signal circuit design and troubleshooting in systems, boards and ICs, with emphasis on signal integrity, power integrity, and noise coupling reduction. He has 10 patents covering innovative solutions in noise coupling reduction and signal integrity, and is author of Noise Coupling in Integrated Circuits: A Practical Approach to Analysis, Modeling, and Suppression. He has a doctorate in electrical engineering from Stanford, and teaches courses in analog circuit design, data converters, and power integrity at UCLA Extension.
ZULKI KHAN is founder and president of NexLogic Technologies, a PCB design, fabrication and assembly company. Prior to starting NexLogic, he was general manager for Imagineering. He also worked on high-speed PCB designs with signal integrity analysis. He holds a bachelor’s in electrical engineering from NED University and an MBA from the University of Iowa and is a frequent author of contributed articles to EMS industry publications.
NICK KOOP is senior field applications engineer at TTM Technologies. Prior to joining TTM in 2013, he spent more than 25 years at Minco, where he held a series of positions including flex circuit product manager and chief design engineer. He has a bachelor’s in mechanical engineering from the University of Minnesota Institute of Technology and a master’s in management of technology from the University of Minnesota Center for the Development of Technical Leadership.
MARK LAING has over 25 years’ experience in PCB manufacturing with particular strengths in test and inspection methodologies with Marconi Instruments, GenRad and Teradyne. He then moved in to software solutions for Router Solutions Inc. prior to its 2006 acquisition by Mentor Graphics. In 2010, he he became product marketing manager and later business development manager at Valor. He two patents, one in the UK and one in the US, and has recently filed a third one. He has a bachelor’s in electrical and electronic engineering from Loughborough University (UK).
HUMAIR MANDAVIA is chief strategy officer of the SOZO Center of Zuken USA. He previously was senior technical marketing manager, focusing in the areas of package and PCB system-level design. His professional career started as a hardware design engineer in the telecommunications industry, and he joined Zuken in 2004 as an applications engineer. He has a bachelor’s in electrical engineering from the University of Texas at Dallas and a master’s in business administration.
JEFF MCALVAY is cofounder and CEO of Tempo Automation, a software-enabled robotic factory for PCB assembly that performs rapid prototyping for many cutting-edge innovators in robotics, aerospace, electric and autonomous vehicles and IoT. Previously, he led automation, operations, product and sales teams at McMaster-Carr, an industrial supply company that provides same-day delivery on more than 500,000 items. While solving various automation challenges at McMaster-Carr and experimenting with John Boyd’s (military strategist and father of the OODA loop decision cycle) rapid iteration methodology, he became enamored with robotics and endeavored on a variety of automation projects: a light controller, a fan controller, and later an autonomous car. During the autonomous car project, he became frustrated with the incompatibility of Boyd’s method with the slow pace of electronics development and so the vision for Tempo Automation was formed.
SUSAN MUCHA is principal at Powell-Mucha Consulting Inc., which provides marketing and sales expertise to EMS companies. She teaches the Introduction to Program Management Course segment of IPC's EMS Program Management Certification Program. Prior to founding PMCI, she spent over 20 years working for EMS companies in marketing and sales management positions. Her last corporate position was as a vice president and corporate officer of Elamex, a publicly traded EMS company. She has a master’s from the University of Alabama-Huntsville and a bachelor’s in journalism from the University of Florida. She is a Certified Manager through the Institute of Certified Professional Managers (ICPM) and an Accredited Business Communicator through the International Association of Business Communicators (IABC). She is author of Find It. Book It. Grow It. A Robust Process for Account Acquisition in Electronics Manufacturing Services.
KATHY NARGI-TOTH has worked in the industry for a number of years in job functions including engineering manager for a multilayer PCB manufacturer, technical marketing manager for a specialty laminate and chemical supplier, global business development director for a supplier to the connector industry and editor for PCD&F Magazine. She currently heads the quality systems and engineering groups for a supply chain management company with 14 offices located in Europe, Asia and the US.
DR. ZHEN MU has more than 20 years of experience in signal integrity, power integrity and their applications. She is currently responsible for power-aware SI solutions with Cadence-Sigrity products. Dr. Mu received her doctorate in electrical and computer engineering from the University of Manitoba, Canada. She holds two US patents and one Canadian patent.
GREG PAPANDREW has extensive experience in domestic and offshore manufacturing, supply chain management and building creative marketing plans for businesses, enabling your company to lower production costs while raising sales numbers. He previously founded a major bare board distribution company.
GERNOT SEEGER joined Beta Layout as business development manager. In November 2011 he became operations manager, and in January 2014 became managing director of Beta Layout GmbH. He played a key role in setting up the PCB assembly production department and in the design and development of the RFID Magic Application Machine (MAM). He has a graduate degree in electrical engineering.
HEMANT SHAH has been with Cadence Design Systems SPB division since 2000, most recently as product management group director – Allegro PCB & FPGA products. Previously, he was engineering director for advanced development at Xynetix Design Systems, where he also held a product marketing director role. He holds a bachelor’s in electrical engineering and a master’s in computer science.
JAY SHAH is lead application engineer at Cadence Design Systems. He predominantly works with signal integrity/power integrity tools, as well as PCB design tools with customers such as Intel, TI, ARM, Broadcom and Google. He helps customers in software evaluation and debugging issues. Prior to Cadence, he was involved with hardware design, simulation and testing with eInfochips.
BEHROOZ SHAMSODINI joined NCAB Group USA in 2016 as field application engineer for the West Coast. Prior to that, he worked at Meiko Electronics as a front-end engineer. Shamsodini has a bachelor’s in electrical engineering from Portland State University.
DOUGLAS SMITH is an independent consultant specializing in high-frequency measurements, circuit/system design and verification, switching power supply noise and specifications, EMC, and immunity to transient noise. He spent 26 years at AT&T Bell Laboratories, becoming Distinguished Member of Technical Staff. He also was manager of EMC development and test at Auspex Systems. He has a bachelor’s in electrical engineering from Vanderbilt and a master’s from the California Institute of Technology. He is author of High Frequency Measurements and Noise in Electronic Circuits.
JONAH STEPHENSON is S.I.P. system level PCB design engineer for the Apple Watch at Apple Inc. Previously he was PCB design manager at Maxim Integrated and principal PCB design engineer at M&M Specialties. He is a proficient HDI PCB designer for consumer hardware and automated test fixtures, schematic capture, component creation, library maintenance, design for test, design for fabrication, CAM and PCB fabrication. An experienced leader and manager, he says new technologies and opportunities to make innovative changes drive his passion.
BOB VERMILLION is CEO/director of technology, CPP/Fellow IOPP, at RMV Technology Group at the NASA Ames Research Center. A certified ESD & Product Safety Engineer – iNARTE, he has subject matter expertise in the mitigation of mapping triboelectrification for space, ESD materials, packaging and equipment troubleshooting in harsh environments. He is a member of the ESDA Standards Committee and co-chairs the SAE Aerospace & Defense 19A EEE Packaging Subcommittee.
STEVEN WATT is a PCB engineering manager for Zuken USA, Inc. He has more than 25 years of experience in the OCB design industry with an emphasis on IC packaging. He has a diverse work background, which includes several EDA companies, Boeing, Motorola and McDonnell Douglas.
KEVIN WEBB is technical marketing engineer at Mentor Graphics with in-depth knowledge of Valor NPI, automation and PCB manufacturing processes. Prior to joining Mentor, he worked in PCB design, hardware management and application engineering at Blackberry, Foxconn, RadiSys and Nortel.
SUSY WEBB is a senior PCB designer with 37 years’ experience. Her career includes point-to-point microwave network systems, oceanographic oil exploration equipment, and CPCI and ATX computer motherboards. She has set up company standards, documentation, procedures, and library conventions for several companies. Webb is a regular speaker at PCB, IPC and international design conferences, and also consults and trains at individual companies. Her presentations discuss practical implementation of complex engineering concepts, including SI, EMI, stackups and flow into board layouts. She is CID certified and has been a writer/columnist for Printed Circuit Design and Fab magazine and other publications. Webb is an active member of the IPC Designer’s Council Executive Board and education committees and is a member and past president of the Houston Chapter of the Designer’s Council.
DAVID WIENS is business development manager at Mentor Graphics, which he joined in 1999 through the acquisition of VeriBest. Over the past 25 years, he has held various engineering, marketing and management positions within the EDA industry. His focus areas have included advanced packaging, high-speed design, routing technology and integrated systems design. He holds a bachelor’s in computer science from the University of Kansas.
PHIL ZARROW founded ITM Consulting in 1993, and has been involved with PCB fabrication and assembly for more than 35 years. His expertise includes the manufacture of equipment for PCB fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Zarrow is recognized for his expertise in SMT soldering and design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics, Excellon-Micronetics and Universal Instruments, he has extensive hands-on experience with setup and troubleshooting through-hole and SMT processes throughout the world. During his tenure as director of technology development for GSS/Array Technology, he was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes. He is coauthor of the SMTA Process Certification Course.