| 9:00 a.m. to 10:00 a.m. |
1 . Printed Circuit Engineering Association Annual Meeting
Stephen Chavez, Siemens
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| 10:00 a.m. to 12:00 p.m. |
2 . Mastering Signal Integrity Analysis: A Practical Guide for PCB Designers
Tim WangLee, Ph.D., Keysight Technologies
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| 10:00 a.m. to 12:00 p.m. |
3 . Improving Circuit Design and Layout: Strategies for Enhanced Accessibility and Success
Tomas Chester, Chester Electronic Design
|
| 10:00 a.m. to 3:00 p.m. |
4 . Building a Bridge from Design to Manufacture
Susy Webb, Design Science
|
| 10:00 a.m. to 3:00 p.m. |
5 . Circuit Grounding to Control Noise and EMI
Rick Hartley, Rhartley Enterprises
|
| 10:00 a.m. to 3:00 p.m. |
6 . Beyond the Layers: Advanced Techniques for PCB Stack-Up Design
Troy Hopkins, Hopfinity Designs
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| 10:00 a.m. to 3:00 p.m. |
7 . Heat Management for SMD, LED, and Systems 1W to 50W
Keven Coates, Novium Designs
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| 12:00 p.m. to 1:00 p.m. |
8 . Lunch and Learn (Tuesday Conference Attendees Only)
Sponsored by Polar Instruments
|
| 1:30 p.m. to 3:30 p.m. |
9 . HDI Via Design: Planning the Energy Pipelines
Dan Beeker, NXP Semiconductor
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| 1:30 p.m. to 3:30 p.m. |
10 . Bridging the Gap: Strategies for Effective PCB Design with Pre-Existing Schematics
Lauren Waslick, Newgrange Design
|
| 4:00 p.m. to 5:00 p.m. |
11 . Harnessing the Power of AI in PCB Design: Addressing Challenges and Unlocking Opportunities
David Wiens, Siemens
|
| 4:00 p.m. to 5:00 p.m. |
12 . Stacking the Deck: Maximizing the PCB Layer Design for Signal Integrity and EMC Performance
Dan Beeker, NXP Semiconductor
|
| 4:00 p.m. to 5:00 p.m. |
13 . The Unsung Hero: Via’s Vital Role in PCB Return Paths
Tomas Chester, Chester Electronic Design
|
| 4:00 p.m. to 5:00 p.m. |
14 . Dispelling the Myths and Mysteries of Power Distribution Networks
James Eck, Wavetronix LLC
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| 4:00 p.m. to 5:00 p.m. |
15 . The Importance of Fabrication and Assembly Drawings
Juan Frias, Rivian
|
| 4:00 p.m. to 5:00 p.m. |
16 . How Can We Mitigate Corrosion in ENIG Surfaces through Innovative Process Management? A Design of Experiments Approach
Robin Wieland, Dyconex
|
| 10:00 a.m. to 5:00 p.m. |
S1 . PCB Management Sessions
Gene Weiner, Weiner International
|
Schedule at a Glance
PCB West is the leading technical conference and exhibition for electronics designers, design engineers, fabricators, and assemblers. See you in Santa Clara, California September 30 – October 3, 2025!
| 9:00 a.m. to 11:00 a.m. |
17. Using AI in Hardware and PCB Design: Real Strategies to Increase Efficiency and Output
Ethan Pierce, Dodec Labs
|
| 9:00 a.m. to 11:00 a.m. |
18. Pioneering Solutions in Complex PCB Design for Next-Gen Technology
Stephen Chavez, Siemens
|
| 9:00 a.m. to 11:00 a.m. |
19. Differential Pair Routing for SI and EMI Control
Rick Hartley, Rhartley Enterprises
|
| 9:00 a.m. to 3:30 p.m. |
20. Effective PCB Design: Techniques to Improve Performance
Dan Beeker, NXP Semiconductor
|
| 11:00 a.m. to 12:00 p.m. |
21. AI’s Evolving Impact on Hardware Development Workflows
Kyle Dumont, Allspice.io
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| 12:00 p.m. to 1:00 p.m. |
22. Lunch on Show Floor
|
| 1:30 p.m. to 3:30 p.m. |
23. Introduction to System Design Automation: Design and Validate Circuits with AI
Tomide Adesanmi, Circuit Mind
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| 1:30 p.m. to 3:30 p.m. |
24. Design for Sourcing: Engineering for Supply Chain Resilience
Ed Dodd, CoFactr
|
| 1:30 p.m. to 3:30 p.m. |
25. Bypass Capacitor Placement with Simulations and Correlations
Keven Coates, Novium Designs
|
| 4:00 p.m. to 5:00 p.m |
26. Exploring the World of Ultra-High-Density Interconnect (UHDI) PCB Design
Stephen Chavez, Siemens
|
| 4:00 p.m. to 5:00 p.m. |
27. High Power PCB Design: Pushing the Limits
Caleb Buck, Nidec Aerospace
|
| 5:00 p.m. to 6:00 p.m. |
Evening Reception
Sponsored by Cofactr and EMA Design Automation
|
| 6:30 p.m. to 7:30 p.m. |
Designer Meetup
|
| 10:00 a.m. to 11:00 a.m |
F1. Panel: Heterogeneous Packaging
|
| 10:00 a.m. to 11:00 a.m |
F2. Basics of Flex Design
Lauren Waslick, Newgrange Design
|
| 10:00 a.m. to 11:00 a.m. |
F3. Enhancing PCB Production: Added Value and New Features by Inkjet
Celia Wenzler, Notion Systems
|
| 11:00 a.m. to 12:00 p.m. |
F4. Keynote
|
| 11:00 a.m. to 12:00 p.m. |
F5. Picosecond Laser Drilling for improved Microvia Performance and Reliability
Javier Gonzalez, Photonics Systems USA
|
| 12:00 p.m. to 1:00 p.m. |
Lunch on Show Floor
|
| 1:30 p.m. to 2:30 p.m. |
F7. The Future of PCB Design: Looking 2-5 Years Ahead, What is Coming?
Matt Leary, Newgrange Design
|
| 1:30 p.m. to 3:30 p.m. |
F8. The Most Common Issues Seen in Incoming Designs for PCB Fabrication
Mike Tucker, Millenium Circuits, and Ray Fugitt, Downstream Technologies
|
| 4:00 p.m. to 5:00 p.m. |
F9. State of Hardware 2025: 1,000 Engineers on Trends, Challenges and Toolsets
Valentina Ratner, Allspice.io
|
| 4:00 p.m. to 5:00 p.m. |
F10. IPC-6012F Applied to PCB Manufacturing
Mike Marshall and Ryan Miller, NCAB Group
|
| 5:00 p.m. to 6:00 p.m. |
Evening Reception
Sponsored by Cofactr and EMA Design Automation
|
| 9:00 a.m. to 11:00 a.m |
28. Ask the Flexperts
Mark Finstad, Flexible Circuit Technologies, and Nick Koop, TTM Technologies
|
| 9:00 a.m. to 2:00 p.m. |
29. RF and Mixed Signal PC Board Design
Rick Hartley, Rhartley Enterprises
|
| 9:00 a.m. to 2:00 p.m. |
30. Introduction to Signal Integrity/High-Speed PCB Layout
Keven Coates, Novium Designs
|
| 9:00 a.m. to 6:00 p.m. |
31. How PCB Design Affects Fabrication
Paul Cooke, AGC Multi-Material
|
| 9:00 a.m. to 6:00 p.m. |
32. Feeding The Hungry Lion – Power Delivery System Design for Today’s Demanding Modern ICs
Chuck Corley, Speeding Edge
|
| 9:00 a.m. to 6:00 p.m. |
33. EMC is not Black Magic
Karen Burham, EMC United
|
| 9:00 a.m. to 6:00 p.m. |
34. PCB Design for Engineers
Susy Webb, Design Science
|
| 11:00 a.m. to 2:30 p.m. |
35. DDR5 Through the Eyes of the Designer
Charlene McCauley and Terrie Duffy, McCauley Design Group
|
| 12:30 p.m. to 1:30 p.m. |
36. Lunch-and-Learn (Thursday Conference attendees only)
Sponsored by ASC Sunstone and Screaming Circuits
|
| 2:00 p.m. to 6:00 p.m. |
37. Mixed Signal Design Noise Reduction Techniques
Keith Kowal, Applied Materials
|
| 2:00 p.m. to 6:00 p.m. |
38. Signal Integrity in UHDI PCBs and IC Substrates
Zachariah Peterson, Northwest Engineering Solutions
|
| 2:30 p.m. to 5:00 p.m. |
39. Stable from DC to AC to Daylight – Power Integrity and Decoupling Primer for PCB Designers
Ralf Bruening, Zuken
|
| 10:30 a.m. to 12:30 p.m. |
40. Avoiding Assembly Pitfalls – DfA/DfM Lessons for First PCB Runs
Keven Coates, Novium Designs
|
| 10:30 a.m. to 12:30 p.m. |
41. Mastering Design Rule Check (DRC) Settings for Optimal PCB Design
Troy Hopkins, Hopfinity Designs
|
| 10:30 a.m. to 12:30 p.m. |
42 .
Zachariah Peterson, Northwest Engineering Solutions
|
| 10:30 a.m. to 12:30 p.m. |
43. PCB Layout of Switch Mode Power Supplies
Rick Hartley, Rhartley Enterprises
|
| 10:30 a.m. to 3:30 p.m. |
44. Resolving Board Congestion with Grid Systems
Susy Webb, Design Science
|
| 12:30 p.m. to 1:30 p.m. |
Lunch-N-Learn (Friday Conference Attendees Only)
|
| 2:00 p.m. to 3:00 p.m. |
45. DfM for Ultra High-Density Interconnects (UHDI)
Stephen Chavez, Siemens
|
| 2:00 p.m. to 4:00 p.m. |
46. Designing in 3D, Breaking the Mold
Ethan Pierce, Dodec Labs
|
| 2:00 p.m. to 4:00 p.m. |
47. System Level Simulation to Reduce PCB Field Failures
Harry Kennedy, Jr., Altair
|
| 3:00 p.m. to 4:00 p.m. |
48. How to Safeguard Electronics and Devices with Advanced Protective Coating Technologies
Joseph Juan and Ryan Moore, HZO
|