Schedule at a Glance

PCB West is the leading technical conference and exhibition for electronics designers, design engineers, fabricators, and assemblers. See you in Santa Clara, California September 30 – October 3, 2025!

9:00 a.m. to 10:00 a.m.
1 .  Printed Circuit Engineering Association Annual Meeting
Stephen Chavez, Siemens
10:00 a.m. to 12:00 p.m.
2 .  Mastering Signal Integrity Analysis: A Practical Guide for PCB Designers
Tim WangLee, Ph.D., Keysight Technologies
10:00 a.m. to 12:00 p.m.
3 .  Improving Circuit Design and Layout: Strategies for Enhanced Accessibility and Success
Tomas Chester, Chester Electronic Design
10:00 a.m. to 3:00 p.m.
4 .  Building a Bridge from Design to Manufacture
Susy Webb, Design Science
10:00 a.m. to 3:00 p.m.
5 .  Circuit Grounding to Control Noise and EMI
Rick Hartley, Rhartley Enterprises
10:00 a.m. to 3:00 p.m.
6 .  Beyond the Layers: Advanced Techniques for PCB Stack-Up Design
Troy Hopkins, Hopfinity Designs
10:00 a.m. to 3:00 p.m.
7 .  Heat Management for SMD, LED, and Systems 1W to 50W
Keven Coates, Novium Designs
12:00 p.m. to 1:00 p.m.
8 .  Lunch and Learn (Tuesday Conference Attendees Only)
Sponsored by Polar Instruments
1:30 p.m. to 3:30 p.m.
9 .  HDI Via Design: Planning the Energy Pipelines
Dan Beeker, NXP Semiconductor
1:30 p.m. to 3:30 p.m.
10 .  Bridging the Gap: Strategies for Effective PCB Design with Pre-Existing Schematics
Lauren Waslick, Newgrange Design
4:00 p.m. to 5:00 p.m.
11 .  Harnessing the Power of AI in PCB Design: Addressing Challenges and Unlocking Opportunities
David Wiens, Siemens
4:00 p.m. to 5:00 p.m.
12 .  Stacking the Deck: Maximizing the PCB Layer Design for Signal Integrity and EMC Performance
Dan Beeker, NXP Semiconductor
4:00 p.m. to 5:00 p.m.
13 .  The Unsung Hero: Via’s Vital Role in PCB Return Paths
Tomas Chester, Chester Electronic Design
4:00 p.m. to 5:00 p.m.
14 .  Dispelling the Myths and Mysteries of Power Distribution Networks
James Eck, Wavetronix LLC
4:00 p.m. to 5:00 p.m.
15 .  The Importance of Fabrication and Assembly Drawings
Juan Frias, Rivian
4:00 p.m. to 5:00 p.m.
16 .  How Can We Mitigate Corrosion in ENIG Surfaces through Innovative Process Management? A Design of Experiments Approach
Robin Wieland, Dyconex
10:00 a.m. to 5:00 p.m.
S1 .  PCB Management Sessions
Gene Weiner, Weiner International
9:00 a.m. to 11:00 a.m.
17.  Using AI in Hardware and PCB Design: Real Strategies to Increase Efficiency and Output
Ethan Pierce, Dodec Labs
9:00 a.m. to 11:00 a.m.
18.  Pioneering Solutions in Complex PCB Design for Next-Gen Technology
Stephen Chavez, Siemens
9:00 a.m. to 11:00 a.m.
19.  Differential Pair Routing for SI and EMI Control
Rick Hartley, Rhartley Enterprises
9:00 a.m. to 3:30 p.m.
20.  Effective PCB Design: Techniques to Improve Performance
Dan Beeker, NXP Semiconductor
11:00 a.m. to 12:00 p.m.
21.  AI’s Evolving Impact on Hardware Development Workflows
Kyle Dumont, Allspice.io
12:00 p.m. to 1:00 p.m.
22.  Lunch on Show Floor
 
1:30 p.m. to 3:30 p.m.
23.  Introduction to System Design Automation: Design and Validate Circuits with AI
Tomide Adesanmi, Circuit Mind
1:30 p.m. to 3:30 p.m.
24.  Design for Sourcing: Engineering for Supply Chain Resilience
Ed Dodd, CoFactr
1:30 p.m. to 3:30 p.m.
25.  Bypass Capacitor Placement with Simulations and Correlations
Keven Coates, Novium Designs
4:00 p.m. to 5:00 p.m
26.  Exploring the World of Ultra-High-Density Interconnect (UHDI) PCB Design
Stephen Chavez, Siemens
4:00 p.m. to 5:00 p.m.
27.  High Power PCB Design: Pushing the Limits
Caleb Buck, Nidec Aerospace
5:00 p.m. to 6:00 p.m.
Evening Reception
Sponsored by Cofactr and EMA Design Automation
6:30 p.m. to 7:30 p.m.
Designer Meetup
 
10:00 a.m. to 11:00 a.m
F1. Panel: Heterogeneous Packaging
 
10:00 a.m. to 11:00 a.m
F2. Basics of Flex Design
Lauren Waslick, Newgrange Design
10:00 a.m. to 11:00 a.m.
F3. Enhancing PCB Production: Added Value and New Features by Inkjet
Celia Wenzler, Notion Systems
11:00 a.m. to 12:00 p.m.
F4. Keynote
 
11:00 a.m. to 12:00 p.m.
F5. Picosecond Laser Drilling for improved Microvia Performance and Reliability
Javier Gonzalez, Photonics Systems USA
12:00 p.m. to 1:00 p.m.
Lunch on Show Floor
 
1:30 p.m. to 2:30 p.m.
F7. The Future of PCB Design: Looking 2-5 Years Ahead, What is Coming?
Matt Leary, Newgrange Design
1:30 p.m. to 3:30 p.m.
F8. The Most Common Issues Seen in Incoming Designs for PCB Fabrication
Mike Tucker, Millenium Circuits, and Ray Fugitt, Downstream Technologies
4:00 p.m. to 5:00 p.m.
F9. State of Hardware 2025: 1,000 Engineers on Trends, Challenges and Toolsets
Valentina Ratner, Allspice.io
4:00 p.m. to 5:00 p.m.
F10. IPC-6012F Applied to PCB Manufacturing
Mike Marshall and Ryan Miller, NCAB Group
5:00 p.m. to 6:00 p.m.
Evening Reception
Sponsored by Cofactr and EMA Design Automation
9:00 a.m. to 11:00 a.m
28. Ask the Flexperts
Mark Finstad, Flexible Circuit Technologies, and Nick Koop, TTM Technologies
9:00 a.m. to 2:00 p.m.
29. RF and Mixed Signal PC Board Design
Rick Hartley, Rhartley Enterprises
9:00 a.m. to 2:00 p.m.
30. Introduction to Signal Integrity/High-Speed PCB Layout
Keven Coates, Novium Designs
9:00 a.m. to 6:00 p.m.
31. How PCB Design Affects Fabrication
Paul Cooke, AGC Multi-Material
9:00 a.m. to 6:00 p.m.
32. Feeding The Hungry Lion – Power Delivery System Design for Today’s Demanding Modern ICs
Chuck Corley, Speeding Edge
9:00 a.m. to 6:00 p.m.
33. EMC is not Black Magic
Karen Burham, EMC United
9:00 a.m. to 6:00 p.m.
34. PCB Design for Engineers
Susy Webb, Design Science
11:00 a.m. to 2:30 p.m.
35. DDR5 Through the Eyes of the Designer
Charlene McCauley and Terrie Duffy, McCauley Design Group
12:30 p.m. to 1:30 p.m.
36. Lunch-and-Learn (Thursday Conference attendees only)
Sponsored by ASC Sunstone and Screaming Circuits
2:00 p.m. to 6:00 p.m.
37. Mixed Signal Design Noise Reduction Techniques
Keith Kowal, Applied Materials
2:00 p.m. to 6:00 p.m.
38. Signal Integrity in UHDI PCBs and IC Substrates
Zachariah Peterson, Northwest Engineering Solutions
2:30 p.m. to 5:00 p.m.
39. Stable from DC to AC to Daylight – Power Integrity and Decoupling Primer for PCB Designers
Ralf Bruening, Zuken
10:30 a.m. to 12:30 p.m.
40. Avoiding Assembly Pitfalls – DfA/DfM Lessons for First PCB Runs
Keven Coates, Novium Designs
10:30 a.m. to 12:30 p.m.
41. Mastering Design Rule Check (DRC) Settings for Optimal PCB Design
Troy Hopkins, Hopfinity Designs
10:30 a.m. to 12:30 p.m.
42 . 
Zachariah Peterson, Northwest Engineering Solutions
10:30 a.m. to 12:30 p.m.
43. PCB Layout of Switch Mode Power Supplies
Rick Hartley, Rhartley Enterprises
10:30 a.m. to 3:30 p.m.
44. Resolving Board Congestion with Grid Systems
Susy Webb, Design Science
12:30 p.m. to 1:30 p.m.
Lunch-N-Learn (Friday Conference Attendees Only)
2:00 p.m. to 3:00 p.m.
45. DfM for Ultra High-Density Interconnects (UHDI)
Stephen Chavez, Siemens
2:00 p.m. to 4:00 p.m.
46. Designing in 3D, Breaking the Mold
Ethan Pierce, Dodec Labs
2:00 p.m. to 4:00 p.m.
47. System Level Simulation to Reduce PCB Field Failures
Harry Kennedy, Jr., Altair
3:00 p.m. to 4:00 p.m.
48. How to Safeguard Electronics and Devices with Advanced Protective Coating Technologies
Joseph Juan and Ryan Moore, HZO