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2019 Schedule-at-a-Glance

 

Monday Sept 9th

Monday, September 9th
8:00 a.m.
Conference Coffee Break, Sponsored by Sierra Circuits
8:30 a.m. – 12:00 p.m.
1: Developing an AI Strategy to Address a CAD/CAM Design Process Bottleneck
Speaker: Daniel Smith, Raytheon Missile Systems
9:00 a.m. - 12 noon
2: The Complete Guide to Characterizing Transmission Lines with a TDR
Speaker: Dr. Eric Bogatin, Teledyne LeCroy
 
3: Ask the Flexperts – Flexible Circuit Design through Test with Lessons Learned
Speakers: Mark Finstad, Flexible Circuit Technologies, and Nick Koop, TTM Technologies
9:00 a.m. - 5:30 p.m.
4: PCB Stackup Design and Materials Selection
Speaker: Bill Hargin, Z-zero
 
5: The Basics of PCB Design for Novices and Engineers
Speaker: Susy Webb, Design Science
 
6: Advanced PCB Fabrication and Defects
Speaker: Paul Cooke, FTG
12:00 p.m. – 1:00 p.m.
LUNCH-N-LEARN, sponsored by Summit Interconnect
1:30 p.m. - 5:00 p.m.
7: Effective PCB Design: Techniques to Improve Performance
Speaker: Dan Beeker, NXP Semiconductor
1:30 p.m. - 2:30 p.m.
8: Accelerate PCB Design Layout Using AI and Machine Learning
Speaker: Naveid Rahmatullah and Xiao-Ming Gao, Intel
1:30 p.m. - 3:30 p.m.
9: IoT (Internet of Things) PC Board Design
Speakers: Rick Hartley, RHartley Enterprises
 
10: From DC to AC - Power Integrity and Decoupling Primer for PCB Designers
Speaker: Ralf Bruening, Zuken EMC Technology Center
1:30 p.m. - 5:00 p.m.
11: Design, Fabrication and Assembly Process Principles for Flexible and Rigid-Flex Circuits
Speaker: Vern Solberg, Solberg Technical Consulting
3:00 p.m. – 5:00 p.m.
12: How to Fight Magnetic Noise Gremlins
Speaker: Keven Coates, Geospace Technologies
3:30 p.m. – 5:30 p.m.
13: Signal Attenuation in Very High-Speed Circuits
Speaker: Rick Hartley, RHartley Enterprises

 

Tuesday Sept 10th

Tuesday, September 10th
8:00 a.m.
Conference Coffee Break, Sponsored by Sierra Circuits
8:30 a.m. – 12 noon
14: The Complexities of Fine Pitch BGA Design
Speaker: Susy Webb, Design Science
 
15: Moving Beyond SMT: Heterogeneous Assembly
Speaker: Phil Marcoux, PPM Associates
 
16: Embedding Passive and Active Components: PCB Design, Fabrication Methodologies and Assembly Process Strategy
Speaker: Vern Solberg, Solberg Technical Consulting
 
17: The Basics of PCB Fabrication (101)
Speaker: Paul Cooke, FTG
9:00 a.m. – 10:00 a.m.
18: How the IPC Digital Product Model (DPM) Working with IPC Connected Factory Exchange (CFX) Can Improve Product Quality, Performance and Reliability
Speaker: Hemant Shah, Cadence Design Systems
9:00 a.m. – 11:00 a.m.
19: An Intuitive Approach to Understanding Basic High-speed Layout
Speaker: Keven Coates, Geospace Technologies
 
20: PCB Layout of Switch Mode Power Supplies
Speaker: Rick Hartley, RHartley Enterprises
10:00 a.m. – 12 noon
21: PCB Design Techniques to Improve ESD Robustness
Speaker: Dan Beeker, NXP Semiconductor
11:00 a.m. – 12 noon
22: Multidiscipline Real-Time Team Design - SI/PI engineers team up with PCB Designers to shorten design cycle
Speaker: Michael Catrambone, Cadence Design Systems
 
23: PCB Transmission Line 101
Speaker: Atar Mittal, Sierra Circuits
12 noon – 1:00 p.m.
LUNCH ON SHOW FLOOR, Sponsored by Sierra Circuits
1:30 p.m. – 3:30 p.m.
24: Power Distribution Made Easy
Speaker: Dan Beeker, NXP Semiconductor
1:30 p.m. – 5:00 p.m.
25: Designing PCBs with HDI Technology
Speaker: Susy Webb, Design Science
1:30 p.m. – 5:00 p.m.
26: Circuit Grounding to Control Noise and EMI
Speakers: Rick Hartley, RHartley Enterprises
 
27: PCB Design for High Reliability
Speaker: Paul Cooke, FTG
 
28: Establishing an Effective PCB Systems Design Validation Process to Reduce Design Spins and Increase Product Quality
Speaker: David Wiens, Mentor, a Siemens Business
 
29: Heat Management for SMD, LED, and Systems 1W to 50W
Speaker: Keven Coates, Geospace Technologies
 
30: Cost-Conscious Test Strategies for Electronic Products
Speaker: Robert Hanson, Americon
3:30 p.m. - 5:30 p.m.
31: Better Board Buying
Speaker: Greg Papandrew, Better Board Buyers
5:00 p.m. – 6:00 p.m.
EVENING RECEPTION ON THE EXHIBIT FLOOR sponsored by Ultra Librarian

 

Tuesday Sept 10th - FREE SESSIONS

Tuesday, September 10th - Free Sessions
9:00 a.m. – 10:00 a.m.
F1: Last Minute DfM in a Crazy Prototype World
Speaker: Duane Benson, Screaming Circuits

Competition is intense, and timelines are shorter than ever, but it still pays to do things right the first time. The majority of delays and reliability issues with prototypes and small-volume production are the result of a small handful of design traps. This session covers the top traps that cause issues in the PCB assembly phase, and how to avoid those problems. DfM isn’t just about solderability anymore. It reaches way back into the design phase and includes files and documentation, components, PCBs, processes and communications. Learn about the most common traps that cause problems in manufacturing, with special emphasis on layout of complex component form factors.

Who should attend: PCB Designer, Design Engineer, System Designer, Hardware Engineer
Target audience: Beginner, Intermediate
 
F2: Effect of Stimulus Patterns (Even/Odd) on Supply Rail Noise and Resonance in PDN in Parallel Bus Interface
Speaker: Vinod Huddar, Western Digital

Choosing the right stimulus patterns in parallel bus SI-PI Co-sims is critical to sign off an interface. Stimulus pattern decides the amount of PDN noise and its effect on signal integrity. Stimulus pattern role becomes crucial when PDN has resonance, and this can have a significant effect on a signal’s eye and EMI of the board. Stimulus can be even mode, odd mode or random. Each of these patterns has different effects on PDN noise. This presentation outlines the effect of these patterns on PDN and its impact on resonance in PDN and eye of signals with respect to DDR4 interface.

Who should attend: Hardware Engineer, SI Engineer
Target audience: Intermediate
10:00 a.m. – 11:00 a.m.
F3: What Every Circuit Board Designer Needs to Know about SI and PI
Speaker: Dr. Eric Bogatin, Teledyne LeCroy

In preparation for this presentation, we talked to many of the largest PCB manufacturers in the US and abroad. We then developed a list of the most common errors found on incoming designs. We started with 10, and now, based on popular demand, we've expanded and keep updating that list. We look at each of the errors and discuss ways to find them before the designs are sent out for manufacturing. Methods we will look at include netlist comparison, design for manufacturing, and design rule analysis. We encourage attendee participation and ask folks to bring their challenges for discussion. After this seminar, the PCB designer will take back some knowledge to better assist them in using their existing tools in the market to produce better and more accurate designs. This year we have asked another FAE to join us with his insights on incoming data as well.

Who should attend:  PCB Designer/Design Engineer, Hardware Engineer, SI Engineer, Fabricator Engineer/Operator,Test Engineer
Target audience: Beginner,Intermediate
 
F4: Tier 3 Reciprocal BoM Methods Contest Tier 1 Cost Models
Speaker: Joe Fama, TCE Inc.

Tier 3 EMSs are occasionally challenged by competition from Tier 1 EMSs. It is a given Tier 3s are over-matched in some ways, with the largest disparity coming from the bill-of-materials cost comparisons. Since BoM costs are typically 75% to 80% of the offered unit price, Tier 1s hold an indisputable advantage based on their inherent purchasing power. As a result, the EMS industry has a notorious pecking order where Tier 3 EMSs typically avoid Tier 1 competition. As a result, Tier 3 EMSs’ business growth is compromised, and the available market for Tier 3s is narrowed. This unceremonious resignation of these types of competitive forays can be eliminated by having Tier 3s adopt an aggressive yet safe program through full transparent collaboration with the potential customer. The resulting outcome will not only rival Tier 1 competition but create a more attractive and integrated end quote to the customer. The Tier 3 Reciprocal BoM program will explain the logic, the math, the working models and the outcomes on how Tier 3s are able to directly compete against Tier 1 EMSs, while creating a long-term business relationship.

Who should attend: Marketing, Sales, Management
Target audience: Intermediate
11:00 a.m. – 12:00 noon
F5: How Leveraging Software-Powered Electronics Manufacturing Facilitates Innovation and Enables Faster Time-to-Market for PCBA
Speaker: Shashank Samala, Tempo Automation

Driven by aggressive deployment and production cycles, engineers developing PCBs for critical systems (aerospace, medical, etc.) need the ability to rapidly iterate on their designs. However, while PCB design and manufacturing are core to many new innovations, it also remains a bottleneck in the product development process. The traditional electronics manufacturing process for prototypes is slow, opaque and low-quality. It’s a black box that offers designers and engineers little, if any, insight into the outcome of their designs prior to manufacture. The white box approach, on the other hand, fills that communication gap, automating the information flow from the engineer’s design to the connected factory floor in a continuous cycle of design, build, and test. By facilitating transparent communication between designer and manufacturer, software-driven automation enables the two teams to work synergistically in an end-to-end loop, so engineers can get the rich feedback they need to continuously reiterate their designs for improved innovation. Not only does this software-powered manufacturing process help engineers gain key insights to make their designs more effective, but it also drastically reduces production time. The manufacturing industry is experiencing its first radical change in decades. While the traditional engineering cycle from design to manufacturing can take months or even years, smart manufacturing practices are empowering engineers to bring their designs from concept to prototype more quickly, thus enabling them to experiment and innovate more often. This presentation will inform engineers, designers, product managers, and others involved in manufacturing for the aerospace, industrial, medical technology, and automotive industries about model-based PCB assembly (PCBA) manufacturing and how adding software and automation to these systems helps engineers drastically reduce production time and bring their innovations to market more quickly.

Who should attend: PCB Designer, Design Engineer
Target audience: Intermediate
 
F6: Design Considerations for Heavy Copper PCBs
Speaker: Greg Ziraldo, Advanced Assembly

Fabricating and assembling high-current, heavy copper printed circuit boards (PCBs) can be difficult, as the heavy copper functions like a double-edged sword. While heavy copper serves to remove heat efficiently from a board during operating, it does the same while soldering components to the same board. To achieve proper soldering, it may be necessary to apply extra heat to the junction, which may be harmful to the component being soldered. Attendees will receive practical design recommendations and guidance to follow when using heavy copper elements in PCBs. Topics to be covered include material considerations, extra heat requirements, soldering challenges, temperature recommendations, optimizing reflow and much more.

Who should attend: PCB Designer, Design Engineer, Fabricator Engineer/Operator
Target audience: Beginner, Intermediate
1:00 p.m. – 2:00 p.m.
F7: Unleashing Electronics Design with Additive Manufacturing
Speaker: Ofer Maltiel, Nano Dimension

As product complexity continues to climb, and smaller, thinner devices packed with added functionality trend upward, moving quickly from design validation to production is a major challenge for the highly competitive electronics industry. Additive manufacturing of electronics provides design engineers with the tools needed to overcome this challenge and gain a competitive advantage. The “factory in a box” approach allows for rapid in-house prototyping and manufacturing, saving time and money. A fully additive process creates design freedom, allowing designers to make the previously unmakeable, and, because all development is done in-house, sensitive and valuable IP is safe from the potentially prying eyes of outsourced prototyping facilities. Through a presentation of real-world examples and use cases in various industries and applications, this session will discuss the power and flexibility of additive manufacturing of electronics and the revolutionary role additive manufacturing plays to speed market-readiness of PCBs, sensors, RF circuits and more. Attendees will learn how additive manufacturing systems and materials come together to redefine the boundaries of existing applications and create limitless possibilities for the future.

Who should attend: PCB Designer, Design Engineer
Target audience: Beginner, Intermediate
 
F8: Going Paperless to FAB and Assembly with IPC-2581
Speakers: Stan Keightley Jr., WISE Software Solutions

You finished your CAD design and are ready to release to manufacturing. You exported the Gerber and drill files, print out the paper fab and assembly drawings, and call it good. Is there a better way? What if I output to IPC-2581 format? How will this improve my data transfer from design to fab and assembly? IPC-2581 carries the necessary "intelligent" data from the CAD system to fab and assembly that results in more efficient, accurate, and controlled fab and assembly process steps. We will review real-world success in using IPC-2581 data format after CAD is done to augment a stackup with impedances and tolerances, designer/fabrication notes, dimensioning, as well as adding V-scores, milling, panelization, BoMs and solder stencils, while transferring a complete paperless solution to downstream.

Who should attend: PCB Designer, Design Engineer, Fabricator Engineer/Operator
Target audience: Intermediate
2:00 p.m. – 3:00 p.m.
F9: An Overview of Glass-Weave Effect for PCB-Based RF and High-Speed Digital Applications
Speaker: John Coonrod, Rogers Corp.

The glass-weave effect and how it can negatively impact circuit performance has been a concern for many years. Historically, it was the high-speed digital industry that embraced several studies related to glass-weave, and the RF industry initially did not pay a lot of attention to the potential effect. However, since millimeter-wave PCB applications have been increasing in recent years, and these applications have very small wavelengths and are more susceptible to glass-weave Dk anomalies, the RF industry is investigating the glass-weave phenomenon in more detail. This presentation will start with an overview of basic PCB properties in which the glass-weave effect can be influential. Following the overview, details will be given from multiple studies that evaluated the glass-weave effect. The output of these studies will be explained with supporting data. The presentation will address different glass styles, different types of glass-weave effects, glass-weave impact on RF performance at millimeter-wave frequencies and provide data showing potential impact on digital systems with propagation delay concerns.

Who should attend: PCB Designer, Design Engineer, System Designer, Hardware Engineer, SI Engineer, Test Engineer
Target audience: Beginner, Intermediate
2:00 p.m. – 4:00 p.m.
F10: 21 (and Counting) Most Common Design Errors, Caught by Fabrication, and How to Prevent Them
Speakers: Dave Hoover, TTM Technologies, Ray Fugitt, Downstream Technologies and Mike Tucker, Kinwong Corporation

In preparation for this presentation, we talked to many of the largest PCB manufacturers in the US and abroad. We then developed a list of the most common errors found on incoming designs. We started with 10 and now, based on popular demand, we've expanded and keep updating that list! We look at each of the errors and discuss ways to find them before the designs are sent out for manufacturing. Methods we will look at include netlist comparison, design for manufacturing, and design rule analysis. We encourage attendee participation and ask folks to bring their challenges for discussion. After this seminar, the PCB designer will take back some knowledge to better assist them in using their existing tools in the market to produce better and more accurate designs. This year we have asked another FAE to join us with his insights to what he sees on incoming data as well.

Who should attend: PCB Designer, Design Engineer, Fabricator Engineer/Operator, Assembly Engineer/Operator
Target audience: Beginner, Intermediate, Advanced
3:00 p.m. – 4:00 p.m.
F11: Characterization of High-Tg FR-4 Reliability in High-Temperature Application
Speaker: Matthew LaBar, Bay Area Circuits, and Troy Topping, Ph.D.

One of the primary failure modes in a high-temperature PCB application is fracture in the copper of a plated through-hole due to a coefficient of thermal expansion (CTE) mismatch in the out-of-plane direction. CTE mismatch has traditionally been mitigated by selecting a polyimide-impregnated base material when the PCB must face an extreme temperature environment, but in recent years improved FR-4 technology has led some designers to choose high-temperature FR-4 as a cheaper base material alternative. Thermal fatigue tests were performed on PCBs made from four different FR-4 materials with glass transition temperatures of at least 170°C. To simulate possible service environments, maximum temperatures ranged from 125°C to 225°C. Cycles to failure are recorded, while PCBs that do not fail are analyzed for changes in electrical performance, dimensional stability, and material fatigue using methods such as time domain reflectometry (TDR), micro-section analysis, and scanning electron microscope (SEM). These results are compared to a polyimide sample that has faced the same temperature cycling. Recommendations are then made regarding use of FR-4 materials at high temperatures.

Who should attend: PCB Designer, Design Engineer, System Designer, Hardware Engineer, SI Engineer
Target audience: Intermediate, Advanced
4:00 p.m. – 5:00 p.m.
F12: Jump-Starting your PCB Design – Getting the Data Upfront (Rules, Stackup)
Speaker: Ed Acheson, Cadenc

The new design packet is dropped on your desk. The typical details are there: the who, the what and the when (with hopes the schedule is padded for sign-off spins). You go over the design data and BoM; check. Netlist; check. Board outline; check. Electrical rules; check. Stackup diagram; check, etc. OK, ready to go. As you begin manually entering stackup data from a PDF spreadsheet, you think, there must be a better way. You also think, who is going to build this PCB, and what rules do I need to pay attention to to ensure an issue free signoff. Designers with years under their belts have learned the techniques to an efficient data transfer from design to manufacturing. Many have built an infrastructure that requires constant maintenance as technology advances. This presentation will provide insights to providing the key requirements in the beginning of the design process, before the first component is added, along with ways to invoke the conversation with the fabricator earlier in the design flow. The designer can realize design details provided by the fabricators in electronic data formats in the very first steps of the design. The details that help reduce iterations for signoff enable faster turn times and reduction of work interruption.

Who should attend: PCB Designer, Design Engineer
Target audience: Beginner, Intermediate, Advanced
4:00 p.m. – 5:00 p.m.
F13: Writing Your Résumé and Marketing Yourself Within Your Company
Speaker: Gary Ferrari, FTG Corp.

Typically, when the words “PCB Design” are heard, one immediately thinks of CAD design tools.  However, there are far more considerations associated with those words in order to produce a truly workable PCB design. This session will visit important design issues that seriously affect the success of a good design. Issues related to electrical performance, mechanical integrity, board fabrication, assembly, test, and field service, to name a few. What you will learn: fabrication – what to look for in laminate selection; what to consider when choosing different surface finishes; how to avoid PCB fabrication issues; selecting an appropriate surface finish; creating an intelligent and manufacturable board stackup; assembly – pitfalls to watch out for when designing with through-hole, surface mount and mixed technologies; different methods used to verify PCB assembly integrity and performance; design issues that negatively affect assembly testing; protective coatings; how to avoid field maintenance or repair issues; documentation issues; the minimum amount of information that must be documented and where. Target audience: designers, engineers, and all levels with an interest in PWB design and manufacturing. Tips for creating a concise résumé and the interview that follows. Are you not moving forward in your current job, or are you currently looking for a job and getting nowhere? The truth is you will probably have around 10 seconds or less to capture the interest of an interviewer. In many cases your resume is reviewed before you are invited for a live interview. This session is intended to guide the creation of a résumé that will highlight, in a brief and concise description, the important information the reviewer is seeking. In addition, we will cover items to have in your HR folder. In part 2, we will look at why everyone around you gets the good assignments, resulting in raises or promotions, while you are overlooked. This will provide pointers on how to market yourself within your company. We will discuss how to highlight your professionalism and catch the eye of peers and management.

Who should attend: PCB Designer, Design Engineer, Hardware Engineer, Fabricator Engineer/Operator, Assembly Engineer/Operator, Test Engineer
Target audience: Beginner
5:00 p.m. – 6:00 p.m.
EVENING RECEPTION ON THE EXHIBIT FLOOR sponsored by Ultra Librarian

Wednesday Sept 11th

Wednesday, September 11th
8:00 a.m.
Conference Coffee Break, Sponsored by Sierra Circuits
8:30 a.m. – 12 noon
32: PCB Design of Power Distribution and Decoupling
Speaker: Rick Hartley, RHartley Enterprises
 
33: A Beginner's Guide to Intuitive RF/Microwave PCB design and Prototyping
Speaker: Benjamin Jordan, Altium
 
34: Part Placement Choices and Consequences
Speaker: Susy Webb, Design Science
9:00 a.m. – 11:00 a.m.
35: The Mystery of Bypass Capacitors
Speaker: Keven Coates, Geospace Technologies
 
36: Electromagnetic Fields for Normal Folks: Show Me the Pictures and Hold the Equations, Please!
Speaker: Dan Beeker, NXP Semiconductor
9:00 a.m. – 5:30 p.m.
37: Design Beyond the CAD Tool 
Speaker: Gary Ferrari, FTG Corp.
11:00 a.m. – 12 noon
38: CAE for Upfront DfM and Configuration Validation of PCB Plating Process
Speaker: Robrecht Belis, Elsyca
11:00 a.m. – 12 noon
39: Integrated Design and Analysis for PCB Designers
Speaker: John Carney, Cadence
12:00 p.m. – 1:00 p.m.
LUNCH-N-LEARN, Sponsored by Polar Instruments

1:30 p.m. – 3:30 p.m.
40: Analytic Approach to Project Management of PCB Designs
Speaker: Timothy Lombard, PCBevo
1:30 p.m. – 2:30 p.m.
41: HDI – High Density Interconnect
Speaker: Harry Kennedy, NCAB Group
1:30 p.m. – 5:00 p.m.
42: Thermal Management Solutions Using PCBs and IMS
Speaker: Mike Tucker, Kinwong Corporation
 
43: RF and Mixed Signal PC Board Design
Speaker: Rick Hartley, RHartley Enterprises
 
44: Mentoring Extended PCB Design Techniques
Speaker: Susy Webb, Design Science
2:30 p.m. - 4:30 p.m.
45: Laying Out Analog/Digital Planes
Speaker: Robert Hanson, Americom

 

Thursday Sept 12th

Thursday, September 12th
8:00 a.m.
Conference Coffee Break
9:00 a.m. – 5:00 p.m.
46: Getting to 32Gb/S: A Tutorial on How to Design Very High-Speed Differential Signals
Speaker: Lee Ritchey, Speeding Edge
12:00 p.m. – 1:00 p.m.
LUNCH-N-LEARN 

 

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