2018 Schedule-at-a-Glance

 

Tuesday Sept 11th

Tuesday, September 11th
8:00 a.m.
Conference Coffee Break, Sponsored by Sierra Circuits
8:30 a.m. – 12:00 p.m.
1: PCB Design Strategy for High Density BGA and CSP Components
Speaker: Vern Solberg, Solberg Technical Consulting
9:00 a.m. - 11:00 a.m.
2: Layout of Switch Mode Power Supplies
Speaker: Rick Hartley, RHartley Enterprises
 
3: Power Distribution Made Easy
Speaker: Daniel Beeker, NXP Semiconductor
9:00 a.m. - 5:00 p.m.
4: The Basics of PCB Design
Speaker: Susy Webb, Fairfield Industries
 
5: What's New in the IPC Design Standards, and How to Use Them
Speakers: Gary Ferrari, FTG Circuits
 
6: PCB Stackup Design and Materials Selection
Speaker: Bill Hargin, Z-zero
 
7: Troubleshooting and Defect Resolution of SMT Assembly Processes
Speaker: Jim Hall and Phil Zarrow, ITM Consulting
11:00 a.m. - 12:00 p.m.
8: Managing Your Impedance, Coupling and Return Paths in Design and Avoid Unnecessary Iterations with SI/PI Engineers
Speakers: Dennis Nagle, Cadence Design Systems
 
9: Evaluating an Appropriate Power Plane through Power Integrity Simulation
Speaker: Richard Villamor Legaspino, Analog Devices and Jay Shah, Cadence
   
12:00 p.m. – 1:00 p.m.
LUNCH-N-LEARN, sponsored by Streamline Circuits
(Tuesday Conference attendees only)
1:00 p.m. – 3:00 p.m.
Power Integrity & Decoupling Primer for PCB Designers
Speaker: Ralf Bruening, Zuken
 
12: Laying Out Analog/Digital Planes
Speaker: Robert Hanson, Americom
1:00 p.m. – 4:30 p.m.
13: Effective PCB Design: Techniques to Improve Performance
Speaker: Daniel Beeker, NXP Semiconductor
 
14: Circuit Grounding to Control Noise and EMI
Speaker: Rick Hartley, RHartley Enterprises
3:00 p.m. – 5:00 p.m.
15: Thermal Integrity within an Electrical Design Flow
Speaker: Speaker: James DeLap, Steven G. Pytel Jr. and Mehdi Abarham, Ansys
 
16: How to Fight Magnetic Noise Gremlins
Speaker: Keven Coates, Geospace

 

Wednesday Sept 12th

Wednesday, September 12th
8:00 a.m.
Conference Coffee Break, Sponsored by Sierra Circuits
8:30 a.m. – 12:00 p.m.
17: The Complexities of Fine Pitch BGA Design
Speaker: Susy Webb, Fairfield Industries
9:00 a.m. – 10:00 a.m.
18: PCB Reverse Engineering Countermeasures
Speaker: Jeremy Hong, Hongs Electronics
9:00 a.m. – 11:00 a.m.
19: Multi-Board Design: Castellation, Connection, SI, Alignment
Speaker: Ben Jordan, Altium
 
20: An Intuitive Approach to Understanding Basic High-speed Layout
Speaker: Keven Coates, Geospace
 
21: A Beginner's Introduction to PCB Trace Impedance
Speaker: Ken Taylor, Polar Instruments
9:00 a.m. – 5:00 p.m.
22: Design for Manufacturing and Assembly
Speaker: Gary Ferrari, FTG Circuits
 
23: The Complete Guide to Understanding Transmission Lines
Speaker: Robert Hanson, Americom
10:00 a.m. – 6:00 p.m.
EXHBITION FLOOR OPEN
10:00 a.m. – 2:00 p.m.
EXHIBIT HALL BOOTH BARISTA, Sponsored by Zuken
10:00 a.m. – 12:00 p.m.
24: iPhone X – Steve Jobs' iPhone
Speaker: Bill Cardoso, Creative Electron
11:00 a.m. – 12:00 p.m.
25: Continuing Test Point Management throughout a PCB Design Flow
Speaker: Mark Laing, Mentor
   
 
27: ECAD-MCAD Co-design for a Competitive Advantage
Speaker: John McMillan, Mentor Graphics
12:00 p.m. – 1:00 p.m.
LUNCH ON EXHIBIT FLOOR, Sponsored by Sierra Circuits
1:00 p.m. – 3:00 p.m.
28: Thermal Design Considerations for SMD PCBs
Speaker: Keven Coates, Geospace
1:00 p.m. – 3:00 p.m.
29: Signal Attenuation in Very High Speed Circuits
Speaker: Rick Hartley, RHartley Enterprises
1:00 p.m. – 4:30 p.m.
30: HDI Routing Solutions
Speakers: Susy Webb, Fairfield Industries
 
31: The Basics of PCB Fabrication (101)
Speaker: Paul Cooke, FTG Circuits
3:00 p.m. - 5:00 p.m.
32: Differential Pair Routing for SI Control
Speaker: Rick Hartley, RHartley Enterprises
 
33: Evaluating the VIA Transition through TDR Simulation
Speaker: Richard Villamor Legaspino, Analog Devices
Wednesday, September 12th - FREE SESSIONS
9:00 a.m. – 11:00 a.m.
F1: Routing & Termination for Control of Signal Integrity
Speaker: Rick Hartley, RHartley Enterprises
 9:00 a.m. – 10:00 a.m.
F2: HDI: High Density Interconnect
Speaker: Chris Nuttall, NCAB Group
10:00 a.m. – 11:00 a.m.
F3: AI and Machine Learning Disrupting the Manufacturing of Your Products
Speaker: Albert Yanez, AsteelFlash
11:00 a.m. – 12:00 p.m.
KEYNOTE: Is Past Prologue? The Future of the PCB Design Industry
Speaker: Walden Rhines, Mentor
11:00 a.m. – 12:00 p.m.
F4: Designing in the Age of Prototypes
Speaker: Milan Shah, Royal Circuits
1:00 p.m. – 2:00 p.m.
F5: Industry 4.0 and IPC-2581
Speaker: Hemant Shah, IPC-2581 Consortium
1:00 p.m. – 3:00 p.m.
F6: The 10+ 21 Most Common Design Errors Caught by Fabrication (and How to Prevent Them)
Speaker: David Hoover, TTM Technologies and Ray Fugitt, DownStream Technologies
2:00 p.m. – 3:00 p.m.
F7: Efficient PCB Interposer Design Using a Novel Smart Router Based on Neural Networks and Genetic Algorithms
Speakers: Xiao Ming Gao, Intel
3:00 p.m. – 4:00 p.m.
F8: Optimizing Hardware for Your IoT Solution
Speaker: Sean Priddy, Creation Technologies
 
F9 (Panel): The Future of PCB Engineers
Phil Marcoux, PPM, Moderator
4:00 p.m. – 5:00 p.m.
F10: 3D Printed Electronics: A New Dimension in Prototyping & Manufacturing
Speaker: Simon Fried, Nano Dimension
 
F11 (Panel): Understanding the AS9100D Standard
Speaker: Peter Bigelow, IMI, Moderator
Wednesday, September 12th - CAD TOOL CORNER – FREE SESSIONS!
1:00 p.m. – 2:00 p.m.
C1: Ensure Your Electronic Design is Reliable and Robust by Simulation – During Schematic, Before Manufacturing and Testing
Speaker: Yizhak Bot, BQR
2:00 p.m. – 3:00 p.m.
C2: Retargeting Your Libraries for Newer, Better Processes without Breaking Your Bank
Speaker: Vince Di Lello, Cadence Design Systems
3:00 p.m. – 4:00 p.m.
C3: Designing PCBs in the Context of a System
Speaker: Gary Hinde, Cadence Design Systems
4:00 p.m. – 5:00 p.m.
C4: Multi-Domain Collaboration for Electronics Systems Design
Speaker: David Wiens, Mentor
5:00 p.m. – 6:00 p.m. EXHIBIT FLOOR RECEPTION, Sponsored by Ultra Librarian

 

Thursday Sept 13th

Thursday, September 13th
8:00 a.m.
Conference Coffee Break, Sponsored by Sierra Circuits
8:30 a.m. – 12:00 p.m.
34: Design of Power Distribution and Decoupling
Speaker: Rick Hartley, RHartley Enterprises
 
35: Part Placement Choices and Consequences
Speaker: Susy Webb, Fairfield Industries
9:00 a.m. - 10:00 a.m.
36: Intelligent DfM for Assembly
Speaker: Kevin Webb, Mentor
 
37: Providing Solutions for Thermal Management within RF Designs
Speaker: James Barry, PCB Technologies
9:00 a.m. – 11:00 a.m.
38: The Mystery of Bypass Capacitors
Speaker: Keven Coates, Geospace
 
39: Ask the Flexperts – Flexible Circuit Design through Test with Lessons Learned
Speaker: Mark Finstad, Flex Circuit Technologies, and Nick Koop, TTM Technologies
9:00 a.m. – 12:00 p.m.
40: Designing Embedded Passives and Related Technologies
Speaker: Gary Ferrari, FTG Circuits
10:00 a.m. – 11:00 a.m.
41: DfM: Getting it Right from the Start
Speaker: Chris Nuttall, NCAB Group
 
42: Arriving at an Optimal Stackup for Printed Circuit Boards Used in Silicon Validation
Speaker: Vijay Nanjai Anandan, Tessolve Semiconductor
10:00 a.m. – 11:00 a.m.
43: Leveraging 3-D Layout to Optimize Rigid-Flex Designs
Speaker: John McMillan, Mentor
 
44: Overview of Several RF Structures and How They Work
Speaker: John Coonrod, Rogers
12:00 p.m. – 1:00 p.m.
LUNCH-N-LEARN, Sponsored by Polar Instruments
(Thursday conference attendees only)
1:00 p.m. – 3:00 p.m.
45: Electromagnetic Fields for Normal Folks: Show Me the Pictures and Hold the Equations, Please!
Speaker: Daniel Beeker, NXP Semiconductor
1:00 p.m. – 4:30 p.m.
46: Flexible and Rigid-Flex Circuit Design and Assembly Process Principles
Speaker: Vern Solberg, Solberg Technical Consulting
 
47: Best DfM Practices for Board Engineers
Speaker: Susy Webb, Fairfield Industries
 
48: RF and Mixed Signal Board Design
Speaker: Rick Hartley, RHartley Enterprises
3:00 p.m. – 5:00 p.m.
49: PCB Design Techniques to Improve ESD Robustness
Speaker: Daniel Beeker, NXP Semiconductor

2018 Sponsors

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