2020 Schedule at a Glance

10:00 a.m. – 6:00 p.m.
1: The Basics of PCB Design
Speaker: Susy Webb, Design Science
10:00 a.m. – 6:00 p.m.
2: A Practical Guide to RF and Microwave PCB Design
Speaker: Ben Jordan, Altium
10:00 a.m. – 5:00 p.m.
3: Printed Circuit Board Stackup Design for High-Performance Products
Speaker: Lee Ritchey, Speeding Edge
10:00 a.m. – 12:00 p.m.
4: Differential Pair Routing for SI and EMI Control
Speaker: Rick Hartley, RHartley Enterprises
10:00 a.m. – 12:00 p.m.
5: Semi-Additive PCB Processing Resets the Technology Curve
Speakers: Mike Vinson, Averatek, and Kelly Dack, KeyTronic
10:00 a.m. – 12:00 p.m.
6: Causes of Signal Degradation in PCB Transmission Lines
Speaker: Atar Mittal, Sierra Circuits
12:00 p.m. – 1:00 p.m.
Lunch-n-Learn, sponsored by Summit Interconnect (Tuesday conference attendees only)
1:00 p.m. – 3:00 p.m.
7: From Smart Factory Automation to Digital Twin Standard: Ushering a New Era for Design and Manufacturing
Speakers:Michael Ford, Aegis Software, and Hemant Shah, Cadence
1:00 p.m. – 4:30 p.m.
8: IoT PC Board Design and Layout
Speaker: Rick Hartley, RHartley Enterprises
1:00 p.m. – 4:30 p.m.
9: Flexible Circuits: Design Through Test with Lessons Learned
Speakers: Mark Finstad, Flexible Circuit Technologies and Nick Koop, TTM Technologies
1:00 p.m. – 4:30 p.m.
10: Effective PCB Design: Techniques to Improve Performance
Speaker: Daniel Beeker, NXP Semiconductor
3:00 p.m. – 5:00 p.m.
11: Next-Generation Materials: High-Speed, RF and HDI Designs
Speaker: Michael R. Creeden, CID+, Insulectro
6:00 p.m. – 8:00 p.m.
Printed Circuit Engineers Association Meeting
10:00 a.m. – 2:00 p.m.
Booth Barista sponsored by Zuken
10:00 a.m. – 2:30 p.m.
12: Embedded Capacitance Technology Concept: Design, Implementation, and Processing Guidelines
Speakers: Robert Carter, Oak-Mitsui Technologies, and Benjamin Jordan, Altium
10:00 a.m. – 12:00 p.m.
13: RF and Mixed Signal PCB Layout
Speaker: Rick Hartley, RHartley Enterprises
10:00 a.m. – 12:00 p.m.
14: An Intuitive Approach to Understanding Basic High-Speed Layout
Speaker: Keven Coates, Geospace Technologies
10:00 a.m. – 12:00 p.m.
15: From DC to AC – Power Integrity and Decoupling Primer for PCB Designers
Speaker: Ralf Bruening, Zuken
12:00 p.m. – 1:00 p.m.
Lunch on the Show Floor, Sponsored by Sierra Circuits
1:30 p.m. – 3:30 p.m.
16: Novel Power Distribution System Design
Speaker: Dan Beeker, NXP Semiconductor
1:30 p.m. – 5:00 p.m.
17: Circuit Grounding to Control Noise and EMI
Speaker: Rick Hartley, RHartley Enterprises
1:30 p.m. – 5:00 p.m.
18: PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology
Speaker: Vern Solberg, Solberg Technical Consulting
1:30 p.m. – 5:00 p.m.
19: Designing the Signal Return Path
Speaker: Susy Webb, Design Science
1:30 p.m. – 5:00 p.m.
20: The PCB Design Process from Cradle to Grave
Speaker: Daniel J. Smith, Raytheon SAS
1:30 p.m. – 5:00 p.m.
21: Place and Route for Dense High-Speed and RF Circuits
Speaker: Michael R. Creeden, CID+, Insulectro
3:00 p.m. – 5:00 p.m.
22: The Mystery of Bypass Capacitors
Speaker: Keven Coates, Geospace Technologies
5:00 p.m. – 6:00 p.m.
Happy Hour on the Show Floor, sponsored by EMA Design Automation and Ultra Librarian
10:00 a.m. – 2:00 p.m.
Booth Barista sponsored by Zuken
9:00 a.m. – 10:00 a.m.
F1: The Butterfly Effect in PCB Design: Optimization of High-speed Lines for an FMC Carrier Board
Speaker: Jamie Pacamarra, Analog Devices
9:00 a.m. – 10:00 a.m.
F2: Millimeter-Wave Concepts Can be Used to Optimize the Performance of High-Speed Digital Circuits
Speaker: John Coonrod, Rogers Corp.
10:00 a.m. – 11:00 a.m.
F3: Electromagnetic Fields for Normal Folks: Show Me the Pictures and Hold the Equations, Please!
Speaker: Daniel Beeker, NXP Semiconductor
 
 
11:00 a.m. – 12:00 p.m.
KEYNOTE: Augmented Reality New Device Challenges and Enabling Industry 4.0
Speaker: Brian Toleno, Ph.D., Microsoft
1:30 p.m. – 2:30 p.m.
F5: Design and Implementation of Copper Coin Application Over Thermal VIA (Vertical Interconnect Access) Structure for Thermal Management up to 12W Device Application
Speakers: Marcus Miguel V. Vicedo, Analog Devices, and Richard Legaspino, Analog Devices
1:30 p.m. – 2:30 p.m.
F6: Accelerate PCB Platforms Layout Design Using AI Smart Router
Speakers: Naveid Rahmatullah, Intel, and Xiao Ming Gao, Intel
2:30 p.m. – 3:30 p.m.
F7: Hair-Raising Footprint Horror Stories – and How to Avoid Them
Speaker: Elizabeth Bustamante, SnapEDA
2:30 p.m. – 3:30 p.m.
F8: The Current State of Fabrication and Assembly – Dispelling Myths, Correcting Misunderstandings, and Explaining Mysteries
Speakers: Shane Shuffield, Advanced Assembly, and Mark Hughes, Advanced Assembly
3:30 p.m. – 4:30 p.m.
F9: PSIJ Effect on SI Analysis of LP4x 4267 Mbps Speed in HHHL PCIe Card
Speakers: Ashish Gupta, Intel and Vinay Kumar Naik, Intel
3:30 p.m. – 4:30 p.m.
F10: PCB Design as an Optimization Problem
Speakers: Zachariah Peterson, Northwest Engineering Solutions
5:00 p.m. – 6:00 p.m.
Happy Hour on the Show Floor, sponsored by EMA Design Automation and Ultra Librarian
10:00 a.m. – 6:00 p.m.
23: PCB Stackup Design and Materials Selection
Speaker: Bill Hargin, Z-zero
10:00 a.m. – 12:00 p.m.
24: Mechanical Design to Control EMI
Speaker: Rick Hartley, RHartley Enterprises
10:00 a.m. – 12:00 p.m.
25: Design-for-Manufacture and Design-for-Assembly Fundamentals that Decrease Holds and Lower the Cost of Manufacturing
Speakers: Mark J. Hughes, Royal Circuit Solutions and Elijah Gracia, Royal Circuit Solutions
10:00 a.m. – 12:00 p.m.
26: How to Fight Magnetic Noise Gremlins
Speaker: Keven Coates, Geospace Technologies
10:00 a.m. – 12:00 p.m.
27: PCB Design Techniques to Improve ESD Robustness
Speaker: Daniel Beeker, NXP Semiconductor
10:00 a.m. – 2:30 p.m
28: Fundamentals of Geometric Dimensioning and Tolerancing (GD&T) for the PWB Design Engineer
Speaker: Gary Ferrari
12:00 p.m. – 1:00 p.m.
Lunch-n-Learn Sponsored by Polar Instruments
1:00 p.m. – 3:00 p.m.
29: Feeding the Beast: Consumption-Based PCB Design
Speaker: Daniel Beeker, NXP Semiconductor
1:00 p.m. – 4:30 p.m.
30: PC Board Design of Power Distribution and Decoupling
Speaker: Rick Hartley, RHartley Enterprises
1:00 p.m. – 4:30 p.m.
31: The Basics of PCB Fabrication (101)
Speaker: Paul Cooke, AGC Nelco – Taconic
1:00 p.m. – 4:30 p.m.
32: Routing Digital Boards to Avoid Problems
Speaker:Susy Webb, Design Science
1:00 p.m. – 4:30 p.m.
33: Heterogeneous OR Mixed-Up Assembly
Speaker:Phil Marcoux, PPM Associates
10:00 a.m. – 4:00 p.m.
34: Power Delivery System Design
Speaker: Lee Ritchey, Speeding Edge
10:00 a.m. – 6:00 p.m.
35: PCB Problem Solving – PCB 102
Speaker: Paul Cooke, AGC-Nelco Taconic
1:00 p.m. – 4:30 p.m.
36: Flexible and Rigid Flex Circuits: Design, Fabrication and Assembly Process Principles
Speaker: Vern Solberg, Solberg Technical Consulting